Company profile
UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration
Solving the fundamental problems of heat transfer, mechanics and materials in semiconductor 3D integration.
- Industry
- Semiconductor Manufacturing
- Employees
- 4
- Headquarters
- West Lafayette, 47907
- LinkedIn followers
- 262
- Office locations
- 1
UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration company summary
UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration is a company in the Semiconductor Manufacturing industry, headquartered in West Lafayette, 47907. On LinkedIn the company has around 4 employees and 262 followers.
What technology does UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration use?
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About UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration
Our group led by Prof. Tiwei Wei, is focusing on two critical challenges in 3D integration technology: (1) Materials, Processing, and Architecture Development for Semiconductor Packaging, where I will share our latest research on the thermal, mechanical stress, and microstructure evolution behaviors in scaling 3D interconnects, as well as novel materials for vertical 3D interconnects; and (2) Heat Transfer in Semiconductor Devices and Advanced Packaging, which involves investigating nanoscale thermal transport phenomena at various levels, from the device level to the BEOL (Back-End-Of-Line), and extending to the chip and packaging levels. In addition, the direct-on-chip two-phase microfluidic cooling, near-junction cooling techniques, and the development of efficient thermal packaging materials designed for extreme thermal isolation and effective heat spreading.
Where is UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration located?
UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration lists 1 location.
Compare companies similar to UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration
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| Company | Industry | Employees | Founded | Headquarters |
|---|---|---|---|---|
UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration s-pack.org | Semiconductor Manufacturing | 4 | - | West Lafayette, 47907 |
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 AMD youtube.com | Semiconductor Manufacturing | 48,633 | 1969 | Santa Clara, California, US |
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 Micron Technology micron.com | Semiconductor Manufacturing | 41,060 | 1978 | Boise, Idaho |
 NXP Semiconductors nxp.com | Semiconductor Manufacturing | 22,532 | 2006 | Eindhoven, Noord-Brabant |
 STMicroelectronics st.com | Semiconductor Manufacturing | 35,970 | 1987 | Geneva, Switzerland |
 TSMC tsmc.com | Semiconductor Manufacturing | 26,376 | - | Hsinchu, Taiwan |
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Frequently asked questions about UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration
What does UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration do?
Our group led by Prof. Tiwei Wei, is focusing on two critical challenges in 3D integration technology: (1) Materials, Processing, and Architecture Development for Semiconductor Packaging, where I will share our latest research on the thermal, mechanical stress, and microstructure evolution behaviors in scaling 3D interconnects, as well as novel materials for vertical 3D interconnects; and (2) Heat Transfer in Semiconductor Devices and Advanced Packaging, which involves investigating nanoscale thermal transport phenomena at various levels, from the device level to the BEOL (Back-End-Of-Line), and extending to the chip and packaging levels. In addition, the direct-on-chip two-phase microfluidic cooling, near-junction cooling techniques, and the development of efficient thermal packaging materials designed for extreme thermal isolation and effective heat spreading.
How many employees does UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration have?
UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration has around 4 employees on LinkedIn.
Where is UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration headquartered?
UCLA Thermal Science Laboratory for Semiconductor Packaging & Integration is headquartered in West Lafayette, 47907.
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